发明授权
- 专利标题: Thermally efficient dielectric resonator support
- 专利标题(中): 高效介质谐振器支架
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申请号: US12609919申请日: 2009-10-30
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公开(公告)号: US08289108B2公开(公告)日: 2012-10-16
- 发明人: Raja K Reddy , Yin-Shing Chong
- 申请人: Raja K Reddy , Yin-Shing Chong
- 申请人地址: FR Paris
- 专利权人: Alcatel Lucent
- 当前专利权人: Alcatel Lucent
- 当前专利权人地址: FR Paris
- 代理机构: Kramer & Amado, PC
- 主分类号: H01P1/201
- IPC分类号: H01P1/201 ; H01P7/10
摘要:
Various exemplary embodiments relate to a temperature compensation structure for use in a dielectric resonator that permits a support to be thermally efficient in rapidly transferring heat generated by a central puck in the resonator. The temperature compensation structure may have an extension shaped to promote heat from the puck into the support, thereby permitting high power operation of the dielectric resonator without overheating.
公开/授权文献
- US20110102109A1 THERMALLY EFFICIENT DIELECTRIC RESONATOR SUPPORT 公开/授权日:2011-05-05