Invention Grant
- Patent Title: Miniature shielded magnetic component
- Patent Title (中): 微型屏蔽磁性元件
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Application No.: US12138792Application Date: 2008-06-13
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Publication No.: US08289121B2Publication Date: 2012-10-16
- Inventor: Yipeng Yan , Robert J. Bogert , Baoqi Wang
- Applicant: Yipeng Yan , Robert J. Bogert , Baoqi Wang
- Applicant Address: US TX Houston
- Assignee: Cooper Technologies Company
- Current Assignee: Cooper Technologies Company
- Current Assignee Address: US TX Houston
- Agency: Armstrong Teasdale LLP
- Priority: CN200710111096 20070615
- Main IPC: H01F17/04
- IPC: H01F17/04 ; H01F27/02 ; H01F17/06 ; H01F27/28 ; H01F27/29 ; H01F7/06

Abstract:
Low profile, shielded magnetic components for circuit board applications include self centering core and coil assemblies with coil receptacle and centering projections formed in core pieces that are assembled around a preformed coil. Welding and plating techniques for forming termination structure for the preformed coil avoid thermal shock issues. External gapping elements and agents to form a gapped core structure are avoided, and gap size in the cores may be tightly controlled over large production lot sizes.
Public/Granted literature
- US20080310051A1 Miniature Shielded Magnetic Component Public/Granted day:2008-12-18
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