Invention Grant
- Patent Title: System and method for testing a digital camera module
- Patent Title (中): 用于测试数码相机模块的系统和方法
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Application No.: US12701724Application Date: 2010-02-08
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Publication No.: US08289397B2Publication Date: 2012-10-16
- Inventor: Chun-Yi Lee
- Applicant: Chun-Yi Lee
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Chi Mei Communication Systems, Inc.
- Current Assignee: Chi Mei Communication Systems, Inc.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200910307977 20090929
- Main IPC: H04N17/02
- IPC: H04N17/02 ; G06K9/00

Abstract:
A method for testing a digital camera module reads a digital image from the digital camera module under test, extracts a tricolor coefficient of each pixel of the digital image to form a measurement array, and compares the measurement array with a reference array to find tricolor coefficient differences. The method extracts an edge of the digital image, processes the edge of the digital image using binarization to obtain measurement binary values, and compares the measurement binary values with reference binary values to find binary values differences. The method further compares a count of the tricolor coefficient differences with a first acceptable value, and compares a count of the binary values differences with a second acceptable value to determine quality of the digital camera module.
Public/Granted literature
- US20110074961A1 SYSTEM AND METHOD FOR TESTING A DIGITAL CAMERA MODULE Public/Granted day:2011-03-31
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