Invention Grant
- Patent Title: Decoupling device
- Patent Title (中): 去耦装置
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Application No.: US12776442Application Date: 2010-05-10
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Publication No.: US08289679B2Publication Date: 2012-10-16
- Inventor: Cheng-Liang Cheng , Chi-Lun Chen , Li-Duan Tsai , Min-Lin Lee , Shur-Fen Liu
- Applicant: Cheng-Liang Cheng , Chi-Lun Chen , Li-Duan Tsai , Min-Lin Lee , Shur-Fen Liu
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW98145811A 20091230
- Main IPC: H01G5/38
- IPC: H01G5/38 ; H01G9/00

Abstract:
A decoupling device includes a lead frame, a capacitor unit, a metal layer, and a high dielectric organic-inorganic composite material layer. The lead frame includes a cathode terminal portion and an anode terminal portion. The capacitor unit is disposed on the lead frame. The capacitor unit includes a cathode portion, an anode portion, and an insulation portion located between the cathode portion and the anode portion. The cathode portion is electrically connected to the cathode terminal portion, and the anode portion is electrically connected to the anode terminal portion. The high dielectric organic-inorganic composite material layer is connected to the capacitor unit in parallel via the metal layer.
Public/Granted literature
- US20110157775A1 DECOUPLING DEVICE Public/Granted day:2011-06-30
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