Invention Grant
- Patent Title: Defect inspection apparatus and defect inspection method
- Patent Title (中): 缺陷检查装置和缺陷检查方法
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Application No.: US12564842Application Date: 2009-09-22
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Publication No.: US08290242B2Publication Date: 2012-10-16
- Inventor: Tadashi Mitsui
- Applicant: Tadashi Mitsui
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2009-004802 20090113
- Main IPC: G06K9/00
- IPC: G06K9/00
Abstract:
A defect inspection method includes: acquiring an image of an inspection pattern obtained by an imaging device, detecting an edge of the inspection pattern in the image, dividing the image into an inspection region and a non-inspection region, using the detected edge as a boundary thereof, performing image processing only on the inspection region to determine the intensity value distribution in the image, and detecting a defect in the inspection pattern based on the obtained intensity value distribution.
Public/Granted literature
- US20100177952A1 DEFECT INSPECTION APPARATUS AND DEFECT INSPECTION METHOD Public/Granted day:2010-07-15
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