发明授权
- 专利标题: Method for manufacturing electronic component
- 专利标题(中): 电子元件制造方法
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申请号: US12195772申请日: 2008-08-21
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公开(公告)号: US08291585B2公开(公告)日: 2012-10-23
- 发明人: Ko Onodera , Satoshi Kurimoto , Hisayuki Abe , Taketo Sasaki , Yoji Tozawa , Osamu Hirose
- 申请人: Ko Onodera , Satoshi Kurimoto , Hisayuki Abe , Taketo Sasaki , Yoji Tozawa , Osamu Hirose
- 申请人地址: JP Tokyo
- 专利权人: TDK Corporation
- 当前专利权人: TDK Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Oliff & Berridge, PLC
- 优先权: JPP2007-216349 20070822; JPP2007-216350 20070822
- 主分类号: H01R9/00
- IPC分类号: H01R9/00 ; H05K3/00
摘要:
A chip element in the form of a substantially rectangular parallelepiped having end surfaces and side surfaces is formed (step of forming chip element). An electrically conductive green sheet is formed (step of forming electrically conductive green sheet). An electrically conductive paste is applied to the end surfaces of the chip element (step of application electrically conductive paste). A chip element is formed in which the electrically conductive green sheet is attached to the end surface via the electrically conductive paste applied to the end surface of the chip element (step of attaching electrically conductive sheet). In the step of attaching, the end surface of the electrically conductive green sheet on the side of the side surfaces is positioned on the outside of the side surfaces, and the electrically conductive paste applied to the end surface is pressed out into a space between the electrically conductive green sheet and ridge portions.
公开/授权文献
- US20090053853A1 METHOD FOR MANUFACTURING ELECTRONIC COMPONENT 公开/授权日:2009-02-26