Invention Grant
- Patent Title: Use of pad conditioning in temperature controlled CMP
- Patent Title (中): 在温度控制CMP中使用焊盘调节
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Application No.: US12240615Application Date: 2008-09-29
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Publication No.: US08292691B2Publication Date: 2012-10-23
- Inventor: Kun Xu , Thomas H. Osterheld , Jimin Zhang , Stephen Jew
- Applicant: Kun Xu , Thomas H. Osterheld , Jimin Zhang , Stephen Jew
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: B24B49/14
- IPC: B24B49/14
Abstract:
A method and apparatus for temperature control for a chemical mechanical polishing process is provided. In one embodiment, the method comprises polishing the substrate with a surface of a polishing pad assembly, measuring a real-time temperature of the surface of the polishing pad assembly, determining whether the real-time temperature of the surface of the polishing pad assembly is within a predetermined processing temperature range, and contacting the surface of the polishing pad assembly with a pad conditioner to adjust the temperature of the surface of the polishing pad assembly to fall within the predetermined temperature range.
Public/Granted literature
- US20100081360A1 USE OF PAD CONDITIONING IN TEMPERATURE CONTROLLED CMP Public/Granted day:2010-04-01
Information query
