Invention Grant
- Patent Title: Solid-state imaging device and method for making the same
- Patent Title (中): 固态成像装置及其制作方法
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Application No.: US12769265Application Date: 2010-04-28
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Publication No.: US08293585B2Publication Date: 2012-10-23
- Inventor: Takeshi Takeda
- Applicant: Takeshi Takeda
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Rader Fishman & Grauer, PLLC
- Priority: JP2004-357602 20041210
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A solid-state imaging device includes a semiconductor substrate, one or more wiring interlayer films disposed on or above the semiconductor substrate, and one or more metal wires embedded in the wiring interlayer films. The one or more wiring interlayer films are composed of a diffusion preventing material that prevents the diffusion of the metal wire.
Public/Granted literature
- US20100203671A1 SOLID-STATE IMAGING DEVICE AND METHOD FOR MAKING THE SAME Public/Granted day:2010-08-12
Information query
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