Invention Grant
- Patent Title: Light emitting element
- Patent Title (中): 发光元件
-
Application No.: US12068854Application Date: 2008-02-12
-
Publication No.: US08294173B2Publication Date: 2012-10-23
- Inventor: Wei-An Chen , Chu-Ping Fan
- Applicant: Wei-An Chen , Chu-Ping Fan
- Applicant Address: TW Hsinchu
- Assignee: Lextar Electronics Corp.
- Current Assignee: Lextar Electronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: Liu & Liu
- Priority: TW97100284A 20080104
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
The present invention discloses a light emitting element including a carrier, at least one light emitting chip, an adhesive and a first encapsulated layer. The light emitting chip is fixed onto the carrier by the adhesive, and most of the carrier and adhesive are made of a light absorbing material, so that the external luminescence quantum efficiency of the light emitting element is poor. The invention adopts a first encapsulated layer disposed on the carrier to cover the light absorbing material including the adhesive or carrier, so as to reduce the light absorption and improve the external luminescence quantum efficiency of the light emitting element.
Public/Granted literature
- US20100301357A1 Light emitting element Public/Granted day:2010-12-02
Information query
IPC分类: