Invention Grant
- Patent Title: Lead frame package
- Patent Title (中): 引线框架封装
-
Application No.: US12186447Application Date: 2008-08-05
-
Publication No.: US08294249B2Publication Date: 2012-10-23
- Inventor: David J. Pilling , Jitesh Shah , Diane Peng , Derek Huang
- Applicant: David J. Pilling , Jitesh Shah , Diane Peng , Derek Huang
- Applicant Address: US CA San Jose
- Assignee: Integrated Device Technology Inc.
- Current Assignee: Integrated Device Technology Inc.
- Current Assignee Address: US CA San Jose
- Agency: Haynes and Boone LLP
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A lead frame package is disclosed where transmission signals are coupled into a die from a pair of lead frames through bonding wires that are separated by no more than three times a diameter of one of the bonding wires. In some embodiments, pairs of lead frames carrying differential transmission signals can be shielded by adjacent pairs of ground and power leads that are coupled into the die through bonding wires that are also separated by no more than three times a diameter of one of the bonding wires.
Public/Granted literature
- US20100032818A1 LEAD FRAME PACKAGE Public/Granted day:2010-02-11
Information query
IPC分类:
