Invention Grant
- Patent Title: Semiconductor package
- Patent Title (中): 半导体封装
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Application No.: US12662269Application Date: 2010-04-08
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Publication No.: US08294255B2Publication Date: 2012-10-23
- Inventor: Kilsoo Kim
- Applicant: Kilsoo Kim
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2009-0044593 20090521
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
The semiconductor package includes a printed circuit board, a first semiconductor chip, and a second semiconductor chip. The printed circuit board includes a slot. The first semiconductor chip is mounted on the printed circuit board to cover a first part of the slot. The second semiconductor chip is mounted on the printed circuit board to cover a second part of the slot separate from the first part. The first semiconductor chip is substantially coplanar with the second semiconductor chip.
Public/Granted literature
- US20100295166A1 Semiconductor package Public/Granted day:2010-11-25
Information query
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