Invention Grant
- Patent Title: LED chip package
- Patent Title (中): LED芯片封装
-
Application No.: US12588125Application Date: 2009-10-06
-
Publication No.: US08294262B2Publication Date: 2012-10-23
- Inventor: Ke-Chin Lee
- Applicant: Ke-Chin Lee
- Applicant Address: CN Zhongshan, Guangdon
- Assignee: Zhongshan Weiqiang Technology Co., Ltd.
- Current Assignee: Zhongshan Weiqiang Technology Co., Ltd.
- Current Assignee Address: CN Zhongshan, Guangdon
- Agency: Bacon & Thomas, PLLC
- Priority: TW98201254U 20090122
- Main IPC: H01L23/34
- IPC: H01L23/34

Abstract:
A LED chip package including a two-phase-flow heat transfer device, at least one LED chip, a metal lead frame and a package material. The two-phase-flow heat transfer device has at least one flat surface. The LED chip is directly or indirectly bonded or adhered to the flat surface of the two-phase-flow heat transfer device. Heat generated by the LED chip can be easily conducted away from the LED chip by the two-phase-flow heat transfer device such as a heat pipe, a vapor chamber and the like so as to prevent heat from accumulating in the LED chip thereby extending the service duration of the LED chip and to prevent the LED chip from deterioration of the light emitting performance caused by the accumulation of heat.
Public/Granted literature
- US20100181593A1 LED chip package Public/Granted day:2010-07-22
Information query
IPC分类: