Invention Grant
- Patent Title: Method for reducing substrate charging
- Patent Title (中): 减少基板充电的方法
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Application No.: US12415937Application Date: 2009-03-31
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Publication No.: US08294976B1Publication Date: 2012-10-23
- Inventor: Ingrid De Wolf , Xavier Rottenberg , Piotr Czarnecki , Philippe Soussan
- Applicant: Ingrid De Wolf , Xavier Rottenberg , Piotr Czarnecki , Philippe Soussan
- Applicant Address: BE Leuven BE Leuven
- Assignee: IMEC,Katholieke Universiteit Leuven, K.U. Leuven R&D
- Current Assignee: IMEC,Katholieke Universiteit Leuven, K.U. Leuven R&D
- Current Assignee Address: BE Leuven BE Leuven
- Agency: McDonnell Boehnen Hulbert & Berghoff LLP
- Main IPC: G02B26/00
- IPC: G02B26/00

Abstract:
An electrostatically actuatable micro electromechanical device is provided with enhanced reliability and lifetime. The electrostatically actuatable micro electromechanical device comprises: a substrate, a first conductor fixed to the top layer of the substrate, forming a fixed electrode, a second conductor fixed to the top layer of the substrate, and a substrate area. The second conductor is electrically isolated from the first conductor and comprises a moveable portion, suspended at a predetermined distance above the first conductor, the moveable portion forming a moveable electrode which approaches the fixed electrode upon applying an actuation voltage between the first and second conductors. The selected substrate surface area is defined as the orthogonal projection of the moveable portion on the substrate between the first and second conductors. In the substrate surface area at least one recess is provided in at least the top layer of the substrate.
Public/Granted literature
- US20120279837A1 METHOD FOR REDUCING SUBSTRATE CHARGING Public/Granted day:2012-11-08
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