发明授权
- 专利标题: Method of constraint-hierarchy-driven IC placement
- 专利标题(中): 限制层次驱动IC放置方法
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申请号: US13349584申请日: 2012-01-13
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公开(公告)号: US08296708B1公开(公告)日: 2012-10-23
- 发明人: Tung-Chieh Chen , Bo-Wei Chen , Ta-Yu Kuan
- 申请人: Tung-Chieh Chen , Bo-Wei Chen , Ta-Yu Kuan
- 申请人地址: TW Hsinchu US CA San Jose
- 专利权人: Springsoft Inc.,Springsoft USA, Inc.
- 当前专利权人: Springsoft Inc.,Springsoft USA, Inc.
- 当前专利权人地址: TW Hsinchu US CA San Jose
- 代理机构: Litron Patent and Trademark Office
- 代理商 Min-Lee Teng
- 主分类号: G06F17/50
- IPC分类号: G06F17/50
摘要:
Disclosed is a computer-implemented method to generate a placement for a plurality of device modules within an analog integrated circuit (IC) subject to a set of constraints. By building a constraint hierarchy tree according to the constraints, conflicts of constraints can be identified and resolved. Furthermore, placements can be generated based on the hierarchy tree through a bottom-to-top dimension optimization process and a top-down wire length optimization process. Furthermore, a graphical user interface can be used to display the tree, and the user can edit the tree visually and interactively.
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