发明授权
- 专利标题： Polishing pad thickness measuring method and polishing pad thickness measuring device
- 专利标题（中）： 抛光垫厚度测量方法和抛光垫厚度测量装置
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申请号： US12694742申请日： 2010-01-27
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公开(公告)号： US08296961B2公开(公告)日： 2012-10-30
- 发明人: Yuichi Nakayoshi , Hiroshi Takai , Hironori Nishimura
- 申请人： Yuichi Nakayoshi , Hiroshi Takai , Hironori Nishimura
- 申请人地址： JP Tokyo
- 专利权人： Sumco Corporation
- 当前专利权人： Sumco Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Greenblum & Bernstein, P.L.C.
- 优先权： JP2009-021594 20090202
- 主分类号： G01B3/20
- IPC分类号： G01B3/20 ; B24B49/02
摘要：
A polishing pad thickness measuring method measures the thickness of a polishing pad attached to an upper surface of a surface plate. The polishing pad thickness measuring method measures a first distance between an upper surface of the polishing pad and a reference position on a vertical line perpendicular to the surface of the polishing pad and a second distance between an upper surface of the surface plate and the reference position on the vertical line, and calculates the thickness of the polishing pad from the difference between the first and second distances.
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