Method of generating electrical energy in an integrated circuit during the operation of the latter, corresponding integrated circuit and method of fabrication

Invention Grant

US08298848B2 Method of generating electrical energy in an integrated circuit during the operation of the latter, corresponding integrated circuit and method of fabrication 有权

Title translation: 在后者的运行期间在集成电路中产生电能的方法，相应的集成电路和制造方法

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Patent Title: Method of generating electrical energy in an integrated circuit during the operation of the latter, corresponding integrated circuit and method of fabrication
Patent Title (中): 在后者的运行期间在集成电路中产生电能的方法，相应的集成电路和制造方法
Application No.: US12793204

Application Date: 2010-06-03
Publication No.: US08298848B2

Publication Date: 2012-10-30
Inventor: Christian Rivero , Pascal Fornara
Applicant: Christian Rivero , Pascal Fornara
Applicant Address: FR Rousset
Assignee: STMicroelectronics (Rousset) SAS
Current Assignee: STMicroelectronics (Rousset) SAS
Current Assignee Address: FR Rousset
Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
Priority: FX0953703 20090604
Main IPC: H01L21/768
IPC: H01L21/768

Method of generating electrical energy in an integrated circuit during the operation of the latter, corresponding integrated circuit and method of fabrication

Abstract:

An integrated circuit may include a region containing a thermoelectric material and be configured to be subjected to a temperature gradient resulting from a flow of an electric current in a part of the integrated circuit during its operation, and an electrically conducting output coupled to the region for delivering the electrical energy produced by thermoelectric material.

Abstract(Chinese):

集成电路可以包括含有热电材料的区域，并且被配置为经受在其工作期间在集成电路的一部分中的电流流动导致的温度梯度，以及耦合到该区域的导电输出传递由热电材料产生的电能。

Public/Granted literature

US20100308898A1 METHOD OF GENERATING ELECTRICAL ENERGY IN AN INTEGRATED CIRCUIT DURING THE OPERATION OF THE LATTER, CORRESPONDING INTEGRATED CIRCUIT AND METHOD OF FABRICATION Public/Granted day:2010-12-09

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/71	..限定在组H01L21／70中的器件的特殊部件的制造（H01L21/28，H01L21/44，H01L21/48优先）
H01L21/768	...利用互连在器件中的分离元件间传输电流