发明授权
- 专利标题： Resin package and production method thereof
- 专利标题（中）： 树脂包装及其制造方法
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申请号： US12406997申请日： 2009-03-19
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公开(公告)号： US08298869B2公开(公告)日： 2012-10-30
- 发明人: Mitsuo Maeda , Yasuo Matsumi
- 申请人： Mitsuo Maeda , Yasuo Matsumi
- 申请人地址： JP Tokyo
- 专利权人： Sumitomo Chemical Company, Limited
- 当前专利权人： Sumitomo Chemical Company, Limited
- 当前专利权人地址： JP Tokyo
- 代理机构： Sughrue Mion, PLLC
- 优先权： JPP2008-073897 20080321
- 主分类号： H01L21/60
- IPC分类号： H01L21/60
摘要：
The method for producing a resin package according to the present invention includes a step of forming a copper oxide layer by oxidizing the surface of a lead frame in which at least the surface is made of copper, and a step of forming a resin package main unit by allowing a resin to adhere to the copper oxide layer on the lead frame surface by resin molding for package, and then removing a predetermined area of the copper oxide layer with an acidic solution.
公开/授权文献
- US20100072433A1 RESIN PACKAGE AND PRODUCTION METHOD THEREOF 公开/授权日：2010-03-25
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