Invention Grant
- Patent Title: Notch positioning type soldering structure and method for preventing pin deviation
- Patent Title (中): 凹口定位型焊接结构及防止引脚偏移的方法
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Application No.: US12841518Application Date: 2010-07-22
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Publication No.: US08299367B2Publication Date: 2012-10-30
- Inventor: Hsiang-Chih Ni , Ching-Feng Hsieh
- Applicant: Hsiang-Chih Ni , Ching-Feng Hsieh
- Applicant Address: TW
- Assignee: Askey Computer Corp.
- Current Assignee: Askey Computer Corp.
- Current Assignee Address: TW
- Agency: Schmeiser, Olsen & Watts, LLP
- Priority: TW99119882A 20100618
- Main IPC: H05K1/16
- IPC: H05K1/16 ; B23K1/20
Abstract:
A notch positioning type soldering structure and a method for preventing a pin deviation can prevent a plurality of pins of an electronic component from being deviated when the pins are soldered onto a printed circuit board by a solder, and each of at least two solder pads includes at least one notch, and the solder pads are installed in an alignment direction on the printed circuit board, such that the notch positioning type soldering structure and the method for preventing a pin deviation can improve the efficiency of manufacturing processes and reduce the manufacturing cost.
Public/Granted literature
- US20110308850A1 NOTCH POSITIONING TYPE SOLDERING STRUCTURE AND METHOD FOR PREVENTING PIN DEVIATION Public/Granted day:2011-12-22
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