Invention Grant
US08299597B2 Semiconductor chip, wiring substrate of a semiconductor package, semiconductor package having the semiconductor chip and display device having the semiconductor package
失效
半导体芯片，半导体封装的布线基板，具有半导体芯片的半导体封装和具有该半导体封装的显示装置
- Patent Title: Semiconductor chip, wiring substrate of a semiconductor package, semiconductor package having the semiconductor chip and display device having the semiconductor package
- Patent Title (中): 半导体芯片，半导体封装的布线基板，具有半导体芯片的半导体封装和具有该半导体封装的显示装置
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Application No.: US12502324Application Date: 2009-07-14
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Publication No.: US08299597B2Publication Date: 2012-10-30
- Inventor: Yun-Seok Choi , Hee-Seok Lee
- Applicant: Yun-Seok Choi , Hee-Seok Lee
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG Electronics Co., Ltd.
- Current Assignee: SAMSUNG Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Stanzione & Kim, LLP
- Priority: KR10-2008-0067866 20080714
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A semiconductor chip can include a semiconductor substrate, an input portion and an output portion. A circuit element can be formed in the semiconductor substrate. The input portion can be formed on the semiconductor substrate. The input portion can include a first input pad to receive an input signal from the outside and a second input pad spaced apart from the first input pad, the second input pad being electrically connected to the first input pad through an external connection line such that the second input pad inputs the input signal to the circuit element. The output portion can be formed on the semiconductor substrate. The output pad can include an output pad to output an output signal from the circuit element.
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Information query
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