发明授权
- 专利标题： Light emitting device package and method of manufacturing the same
- 专利标题（中）： 发光器件封装及其制造方法
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申请号： US12213241申请日： 2008-06-17
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公开(公告)号： US08299692B2公开(公告)日： 2012-10-30
- 发明人: Young Ki Lee , Seog Moon Choi , Hyung Jin Jeon , Sang Hyun Shin
- 申请人： Young Ki Lee , Seog Moon Choi , Hyung Jin Jeon , Sang Hyun Shin
- 申请人地址： KR Seoul
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Seoul
- 代理机构： McDermott Will & Emery LLP
- 优先权： KR10-2008-0039277 20080428
- 主分类号： H01J1/62
- IPC分类号： H01J1/62 ; H01J9/02 ; H01L31/00
摘要：
The present invention relates to a light emitting device package and a method of manufacturing the same. There is provided a light emitting device package including a metal core; an insulating layer formed on the metal core; a metal layer formed on the insulating layer; a first cavity formed by removing parts of the metal layer and the insulating layer to expose a top surface of the metal core; and a light emitting device directly mounted on the top surface of the metal core in the first cavity and further there is provided a method of manufacturing the light emitting device package.
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