发明授权
- 专利标题： Camera module
- 专利标题（中）： 相机模块
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申请号： US13052398申请日： 2011-03-21
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公开(公告)号： US08303196B2公开(公告)日： 2012-11-06
- 发明人: Toyokazu Aizawa , Katsuo Iwata , Takehiro Hiramatsu
- 申请人： Toyokazu Aizawa , Katsuo Iwata , Takehiro Hiramatsu
- 申请人地址： JP Tokyo
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2010-116599 20100520
- 主分类号： G03B17/00
- IPC分类号： G03B17/00
摘要：
According to one embodiment, there is provided a camera module formed with substantially the same scale as a chip of an image sensor, includes a lens held by a lens holder, an image sensor placed in a position in which an image is formed by the lens, and a wiring board disposed between the lens and the image sensor and electrically connected to the image sensor. An opening that permits light entering the image sensor to pass therethrough is formed in the wiring board. Further, a passive component is contained in the wiring board.
公开/授权文献
- US20110286736A1 CAMERA MODULE 公开/授权日：2011-11-24
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