Invention Grant
- Patent Title: Printed circuit board made from a composite material
- Patent Title (中): 印刷电路板由复合材料制成
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Application No.: US13274851Application Date: 2011-10-17
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Publication No.: US08304054B2Publication Date: 2012-11-06
- Inventor: Xinhe Tang , Ka Chun Tse , Ernst Hammel , Ben Zhong Tang
- Applicant: Xinhe Tang , Ka Chun Tse , Ernst Hammel , Ben Zhong Tang
- Applicant Address: DE Eschenbach
- Assignee: Curamik Electronics GmbH
- Current Assignee: Curamik Electronics GmbH
- Current Assignee Address: DE Eschenbach
- Agency: Welsh Flaxman & Gitler LLC
- Priority: DE102005062181 20051223
- Main IPC: B32B5/12
- IPC: B32B5/12 ; B32B27/38 ; C08L63/00 ; C08L67/00 ; H01F1/42
Abstract:
Disclosed is a multilayer material in which at least two components are jointed to each other via an adhesive bond. The adhesive bond is formed by an adhesive or bonding layer containing nanofiber material in a matrix that is suitable as an adhesive.
Public/Granted literature
- US20120031653A1 Printed Circuit Board made from a Composite Material Public/Granted day:2012-02-09
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