Invention Grant
- Patent Title: Manufacturing method of semiconductor device and substrate processing apparatus
- Patent Title (中): 半导体器件和衬底处理设备的制造方法
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Application No.: US12223718Application Date: 2007-03-15
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Publication No.: US08304328B2Publication Date: 2012-11-06
- Inventor: Takahiro Maeda , Kiyohiko Maeda , Takashi Ozaki , Akihito Yoshino , Yasunobu Koshi , Yuji Urano
- Applicant: Takahiro Maeda , Kiyohiko Maeda , Takashi Ozaki , Akihito Yoshino , Yasunobu Koshi , Yuji Urano
- Applicant Address: JP Tokyo
- Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2006-076572 20060320
- International Application: PCT/JP2007/055289 WO 20070315
- International Announcement: WO2007/108401 WO 20070927
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
To realize a high productivity while maintaining excellent film deposition characteristics on a substrate even if a plurality of processing gases of different gas species are used. There are provided the step of loading a plurality of substrates into a processing chamber; supplying a first processing gas to an upper stream side of a gas flow outside of a region where a plurality of substrates loaded into a processing chamber are arranged, supplying a second processing gas to the upper stream side of the gas flow outside of the region where the plurality of substrates loaded into the processing chamber are arranged, supplying the first processing gas to a middle part of the gas flow in the region where the plurality of substrates loaded into the processing chamber are arranged, and causing the first processing gas and the second processing gas to react with each other in the processing chamber, to form an amorphous material and form a thin film on main surfaces of the plurality of substrates; and the step of unloading the substrate after forming the thin film from the processing camber.
Public/Granted literature
- US20090087964A1 Manufacturing Method of Semiconductor Device and Substrate Processing Apparatus Public/Granted day:2009-04-02
Information query
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