发明授权
US08304666B2 Structure of multiple coaxial leads within single via in substrate and manufacturing method thereof
有权
单个通孔中多个同轴引线在基片中的结构及其制造方法
- 专利标题： Structure of multiple coaxial leads within single via in substrate and manufacturing method thereof
- 专利标题（中）： 单个通孔中多个同轴引线在基片中的结构及其制造方法
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申请号： US12468058申请日： 2009-05-19
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公开(公告)号： US08304666B2公开(公告)日： 2012-11-06
- 发明人: Cheng-Ta Ko , Min-Lin Lee , Wei-Chung Lo , Shur-Fen Liu , Jinn-Shing King , Shinn-Juh Lai , Yu-Hua Chen
- 申请人： Cheng-Ta Ko , Min-Lin Lee , Wei-Chung Lo , Shur-Fen Liu , Jinn-Shing King , Shinn-Juh Lai , Yu-Hua Chen
- 申请人地址： TW Hsinchu
- 专利权人： Industrial Technology Research Institute
- 当前专利权人： Industrial Technology Research Institute
- 当前专利权人地址： TW Hsinchu
- 代理机构： Jianq Chyun IP Office
- 优先权： TW97151842A 20081231
- 主分类号： H05K1/11
- IPC分类号： H05K1/11
摘要：
A plurality of coaxial leads is made within a single via in a circuit substrate to enhance the density of vertical interconnection so as to match the demand for higher density multi-layers circuit interconnection between top circuit layer and bottom circuit layer of the substrate. Coaxial leads provide electromagnetic interference shielding among the plurality of coaxial leads in a single via.