Invention Grant
US08304666B2 Structure of multiple coaxial leads within single via in substrate and manufacturing method thereof
有权
单个通孔中多个同轴引线在基片中的结构及其制造方法
- Patent Title: Structure of multiple coaxial leads within single via in substrate and manufacturing method thereof
- Patent Title (中): 单个通孔中多个同轴引线在基片中的结构及其制造方法
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Application No.: US12468058Application Date: 2009-05-19
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Publication No.: US08304666B2Publication Date: 2012-11-06
- Inventor: Cheng-Ta Ko , Min-Lin Lee , Wei-Chung Lo , Shur-Fen Liu , Jinn-Shing King , Shinn-Juh Lai , Yu-Hua Chen
- Applicant: Cheng-Ta Ko , Min-Lin Lee , Wei-Chung Lo , Shur-Fen Liu , Jinn-Shing King , Shinn-Juh Lai , Yu-Hua Chen
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW97151842A 20081231
- Main IPC: H05K1/11
- IPC: H05K1/11
Abstract:
A plurality of coaxial leads is made within a single via in a circuit substrate to enhance the density of vertical interconnection so as to match the demand for higher density multi-layers circuit interconnection between top circuit layer and bottom circuit layer of the substrate. Coaxial leads provide electromagnetic interference shielding among the plurality of coaxial leads in a single via.
Public/Granted literature
- US20100163296A1 STRUCTURE OF MULTIPLE COAXIAL LEADS WITHIN SINGLE VIA IN SUBSTRATE AND MANUFACTURING METHOD THEREOF Public/Granted day:2010-07-01
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