Embodiments of the present invention provide a probe card in which the positional shift of the tip of a probe can be compensated for in response to a change in the temperature, and a wafer test in a wide range of temperatures can be performed. More specifically, the probe card includes a substrate, a probe composed of a first metallic material having a first thermal expansion coefficient, a base of the probe being joined to the substrate, a tip of the probe coming into contact with a connection terminal of an electronic device, and a thermal compensation member composed of a second metallic material having a second thermal expansion coefficient that is higher than the first thermal expansion coefficient, a base of the thermal compensation member being fixed to the substrate, a tip of the thermal compensation member coming into contact with the probe at an intermediate portion between the base of the probe and the tip of the probe.