A clip mechanism includes a first lateral wall whereon a slot is formed, and a second lateral wall disposed on a side of the first lateral wall. At least one opening is formed on the second lateral wall for engaging with a protrusion of a casing. The clip mechanism further includes a bending part bent for connecting the first lateral wall and the second lateral wall. The clip mechanism further includes a resilient arm. A first end of the resilient arm is connected to an end of the slot of the first lateral wall, and a second end of the resilient arm protrudes out of a side of the slot. The resilient arm further includes a contacting part protruding out of the other side of the slot for contacting against an electronic device so as to ground the electronic device.