发明授权
- 专利标题： Enclosure of electronic device
- 专利标题（中）： 电子设备外壳
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申请号： US12855903申请日： 2010-08-13
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公开(公告)号： US08305774B2公开(公告)日： 2012-11-06
- 发明人: Yu-Chang Pai , Po-Chuan Hsieh , Chien-Hung Liu , Shou-Kuo Hsu
- 申请人： Yu-Chang Pai , Po-Chuan Hsieh , Chien-Hung Liu , Shou-Kuo Hsu
- 申请人地址： TW Tu-Cheng, New Taipei
- 专利权人： Hon Hai Precision Industry Co., Ltd.
- 当前专利权人： Hon Hai Precision Industry Co., Ltd.
- 当前专利权人地址： TW Tu-Cheng, New Taipei
- 代理机构： Altis Law Group, Inc.
- 优先权： TW99118297A 20100607
- 主分类号： H05K9/00
- IPC分类号： H05K9/00
摘要：
An enclosure includes a plate. The plate defines a number of through holes. A hollow shield extends from the edges bounding each through hole. A top side of the shield opposite to the plate is smaller than a bottom side of the shield which is connected to the edges of the through hole. The enclosure can better shield electromagnetic interference (EMI) from the electronic device.
公开/授权文献
- US20110299263A1 ENCLOSURE OF ELECTRONIC DEVICE 公开/授权日：2011-12-08
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