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发明授权
US08307534B2 Method of forming a coupled coil arrangement 有权
形成耦合线圈装置的方法

Method of forming a coupled coil arrangement
摘要：
A method of forming an encapsulated coupled coil arrangement. The method includes coupling a first lead of a first coil to a second lead of an electrical circuit device, by soldering or infusion, using a superconductive jointing alloy; and encapsulating the first coil, the electrical circuit device and the jointed leads of the first coil and the electrical circuit device in an encapsulation material. The jointing alloy has a melting point higher than a highest temperature experienced by the encapsulation material having the encapsulation process.
摘要（中）：

一种形成封装的耦合线圈装置的方法。 该方法包括使用超导接合合金将第一线圈的第一引线通过焊接或输注耦合到电路装置的第二引线; 并将第一线圈和电路装置的第一线圈，电路装置和接合引线封装在封装材料中。 接合合金的熔点高于具有封装工艺的封装材料经历的最高温度。

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