发明授权
- 专利标题: Semiconductor device and manufacturing method thereof
- 专利标题(中): 半导体装置及其制造方法
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申请号: US12700536申请日: 2010-02-04
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公开(公告)号: US08309950B2公开(公告)日: 2012-11-13
- 发明人: Masayoshi Iwayama , Takeshi Kajiyama , Yoshiaki Asao
- 申请人: Masayoshi Iwayama , Takeshi Kajiyama , Yoshiaki Asao
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Knobbe, Martens, Olson & Bear LLP
- 优先权: JP2009-214808 20090916
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L21/336
摘要:
First semiconductor layers are in source/drain regions on the semiconductor substrate. A second semiconductor layer comprises first portions on the first semiconductor layers and a second portion on a channel region between the source/drain regions. Third semiconductor layers are on the first portions of the second semiconductor layer. A gate electrode is around the second portion of the second semiconductor layer via an insulating film. Contact plugs are in the first semiconductor layers, the first portions of the second semiconductor layers and the third semiconductor layers in the source/drain regions. A diameter of the contact plug in the second semiconductor layer is smaller than a diameter of the contact plug in the first and third semiconductor layers.
公开/授权文献
- US20110062417A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 公开/授权日:2011-03-17
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