发明授权
- 专利标题： Package-on-package with fan-out WLCSP
- 专利标题（中）： 封装包装与散热WLCSP
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申请号： US13280368申请日： 2011-10-25
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公开(公告)号： US08310051B2公开(公告)日： 2012-11-13
- 发明人: Nan-Cheng Chen , Chih-Tai Hsu
- 申请人： Nan-Cheng Chen , Chih-Tai Hsu
- 申请人地址： TW Science-Based Industrial Park, Hsin-Chu
- 专利权人： Mediatek Inc.
- 当前专利权人： Mediatek Inc.
- 当前专利权人地址： TW Science-Based Industrial Park, Hsin-Chu
- 代理商 Winston Hsu; Scott Margo
- 主分类号： H01L23/52
- IPC分类号： H01L23/52
摘要：
A package-on-package includes a package carrier; a semiconductor die assembled face-down to a chip side of the package carrier; a rewiring laminate structure between the semiconductor die and the package carrier; a plurality of bumps arranged on the rewiring laminate structure for electrically connecting the semiconductor die with the package carrier; and an IC package mounted on the package carrier. The IC package and the semiconductor die are at least partially overlapped.
公开/授权文献
- US20120032314A1 PACKAGE-ON-PACKAGE WITH FAN-OUT WLCSP 公开/授权日：2012-02-09
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