A wiring board of the present invention has pads disposed in a plurality of rows including: first row pads each being connected to a respective one of the connection wires that is long in length; and second row pads (30b) each being connected to a respective one of the connection wires that is shorter in length than that of first connection wires (10a) connected to the first row pads, each of the first connection wires (10a) being provided not in a region between adjacent ones of the second row pads (30b) but in a lower layer region of the second row pads (30b), in such a manner that at least a first insulating layer (20a) is sandwiched between the second row pads (30b) and the first connection wires (10a), and 0.8≦W1/W2≦1, where W1 is a line width of the first connection wires (10a) in the lower layer region of the second row pads (30b), and W2 is a width of the second row pads (30b).