发明授权
- 专利标题: Method of crimping terminal
- 专利标题(中): 压接端子的方法
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申请号: US12845436申请日: 2010-07-28
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公开(公告)号: US08312625B2公开(公告)日: 2012-11-20
- 发明人: Hideto Kumakura
- 申请人: Hideto Kumakura
- 申请人地址: JP Tokyo
- 专利权人: Yazaki Corporation
- 当前专利权人: Yazaki Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Sughrue Mion, PLLC
- 优先权: JP2009-185802 20090810
- 主分类号: H01R43/04
- IPC分类号: H01R43/04
摘要:
An apparatus for crimping a terminal with a wire includes a first crimper and a second crimper. The first crimper presses the terminal with the wire at a first position of the wire. The second crimper presses the terminal with the wire at a second position of the wire after the first crimper presses the terminal at the first position. The first position is disposed between a tip end of the wire and the second position in an extending direction of the wire.
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