Invention Grant
- Patent Title: Multi-slot connector
- Patent Title (中): 多插槽连接器
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Application No.: US13241486Application Date: 2011-09-23
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Publication No.: US08313349B2Publication Date: 2012-11-20
- Inventor: Chia-Chang Tsai , Chih-Kang Wu , Chun-Ta Wu
- Applicant: Chia-Chang Tsai , Chih-Kang Wu , Chun-Ta Wu
- Applicant Address: TW Hsin-chu
- Assignee: Au Optronics Corporation
- Current Assignee: Au Optronics Corporation
- Current Assignee Address: TW Hsin-chu
- Agency: McClure, Qualey & Rodack, LLP
- Priority: TW97134305A 20080905
- Main IPC: H01R24/00
- IPC: H01R24/00

Abstract:
A multi-slot connector and a manufacture method thereof are provided. The multi-slot connector includes a housing and a conducting structure. The conducting structure has a body and a terminal portion extending from the body. After extending out from the body, the terminal portion bends to form a first ridge. After bending the first ridge, the terminal portion turns to form a winding portion which winds back toward the body and bends to form a second ridge, wherein the first and second ridges protrude toward different directions. The housing has a first slot and a second slot. When the conducting structure is disposed in the housing, the first ridge and the second ridge are respectively corresponding to the first slot and the second slot.
Public/Granted literature
- US20120015562A1 Multi-Slot Connector and Manufacture Method Thereof Public/Granted day:2012-01-19
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