Invention Grant
- Patent Title: Circuit board with kneaded conductive paste
- Patent Title (中): 电路板用捏合的导电膏
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Application No.: US12495860Application Date: 2009-07-01
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Publication No.: US08314339B2Publication Date: 2012-11-20
- Inventor: Masayuki Kitajima , Takeshi Ishitsuka , Satoshi Emoto
- Applicant: Masayuki Kitajima , Takeshi Ishitsuka , Satoshi Emoto
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Squire Sanders (US) LLP
- Priority: JP2008-180698 20080710
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/09
Abstract:
A printed wiring board includes a first conductive paste forming a wiring pattern, and a second conductive paste including kneaded first conductive material and second conductive material whose particles are finer than those of the first conductive material.
Public/Granted literature
- US20100006325A1 PRINTED WIRING BOARD Public/Granted day:2010-01-14
Information query
