发明授权
- 专利标题: Method of producing a wired circuit board
- 专利标题(中): 生产有线电路板的方法
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申请号: US12662109申请日: 2010-03-31
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公开(公告)号: US08316532B2公开(公告)日: 2012-11-27
- 发明人: Yoshihiro Toyoda , Terukazu Ihara
- 申请人: Yoshihiro Toyoda , Terukazu Ihara
- 申请人地址: JP Osaka
- 专利权人: Nitto Denko Corporation
- 当前专利权人: Nitto Denko Corporation
- 当前专利权人地址: JP Osaka
- 代理机构: Edwards Neils PLLC
- 代理商 Jean C. Edwards, Esq.
- 优先权: JP2009-099198 20090415
- 主分类号: H05K3/00
- IPC分类号: H05K3/00
摘要:
A producing method of a wired circuit board includes the steps of preparing the wired circuit board, placing the wired circuit board on a support table, and applying light from above the wired circuit board toward the wired circuit board, and sensing pattern reflected light, table reflected light and foreign-matter reflected light to inspect the conductive pattern and the foreign matter based on a contrast therebetween. In the step of inspecting the conductive pattern and the foreign matter, a reflectance of the table reflected light is in a range of 25 to 55%, and a reflectance of the foreign-matter reflected light is in a range of not more than 10%.
公开/授权文献
- US20100263206A1 Producing method of wired circuit board 公开/授权日:2010-10-21
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