发明授权
- 专利标题: Laser processing apparatus
- 专利标题(中): 激光加工设备
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申请号: US12534705申请日: 2009-08-03
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公开(公告)号: US08319143B2公开(公告)日: 2012-11-27
- 发明人: Keiji Nomaru
- 申请人: Keiji Nomaru
- 申请人地址: JP Tokyo
- 专利权人: Disco Corporation
- 当前专利权人: Disco Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Greer, Burns & Crain, Ltd.
- 优先权: JP2008-214853 20080825
- 主分类号: B23K26/00
- IPC分类号: B23K26/00 ; B23K26/06 ; B23K26/02
摘要:
A laser processing apparatus having a holding unit for holding a workpiece to be processed and a processing unit for applying a laser beam to the workpiece held by the holding unit. The processing unit includes an oscillator for oscillating the laser beam, a focusing lens for focusing the laser beam oscillated by the oscillator toward the workpiece, and a focal position adjusting mechanism for adjusting the focal position of the laser beam focused by the focusing lens. The focal position adjusting mechanism includes a movable unit having a permanent magnet and supporting the focusing lens, a fixed portion having a coil for moving the movable unit in a direction perpendicular to the workpiece and a gas bearing for supporting the movable unit by using a gas, and a supporting member for supporting the movable unit from the under side by using a magnetic repulsive action.
公开/授权文献
- US20100044355A1 LASER PROCESSING APPARATUS 公开/授权日:2010-02-25
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