发明授权
- 专利标题: Laser machining method and laser machining apparatus
- 专利标题(中): 激光加工方法和激光加工设备
-
申请号: US11525154申请日: 2006-09-22
-
公开(公告)号: US08319147B2公开(公告)日: 2012-11-27
- 发明人: Kunio Arai
- 申请人: Kunio Arai
- 申请人地址: JP Kanagawa
- 专利权人: Hitachi Via Mechanics, Ltd.
- 当前专利权人: Hitachi Via Mechanics, Ltd.
- 当前专利权人地址: JP Kanagawa
- 代理机构: Wenderoth, Lind & Ponack, L.L.P.
- 优先权: JP2005-288973 20050930; JP2006-246020 20060911
- 主分类号: B23K26/38
- IPC分类号: B23K26/38
摘要:
There is provided a laser machining method and a laser machining apparatus whose machining accuracy and quality excel without lowering machining efficiency. One hole is machined by a split beam that is a first pulsed laser beam and another split beam that is a second pulsed laser beam whose irradiation position is determined based on irradiation position of the first laser beam. In this case, the machining quality may be improved by machining the circular hole by equalizing circling directions and angular velocity of the split beams. A beam splitter splits a laser beam outputted out of one laser oscillator into the split beams and AOMs can time-share them.
公开/授权文献
- US20070075059A1 Laser machining method and laser machining apparatus 公开/授权日:2007-04-05
信息查询
IPC分类: