Invention Grant
- Patent Title: Lead frame and method of manufacturing the same
- Patent Title (中): 引线框架及其制造方法
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Application No.: US12883481Application Date: 2010-09-16
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Publication No.: US08319340B2Publication Date: 2012-11-27
- Inventor: Chang-han Shim , Sung-kwan Paek
- Applicant: Chang-han Shim , Sung-kwan Paek
- Applicant Address: KR Changwon
- Assignee: Samsung Techwin Co., Ltd.
- Current Assignee: Samsung Techwin Co., Ltd.
- Current Assignee Address: KR Changwon
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2009-0094051 20091001
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
A lead frame having improved connectivity with a molded portion and a method of manufacturing the lead frame are provided. The lead frame includes a die pad on which a semiconductor chip is to be disposed; at least one lead portion arranged to be connected to the semiconductor chip; and at least one plating layer formed on at least one of the at least one lead portion and the die pad, wherein a top surface of the at least one plating layer has an uneven portion having a first average surface roughness.
Public/Granted literature
- US20110079887A1 LEAD FRAME AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2011-04-07
Information query
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