The system includes a module fixture supporting a plurality of elements, the module fixture defining a plurality of bonding wells with each bonding well accepting a first portion of one or more of the elements with the module fixture including one or more apertures communicated with one or more of the bonding wells with the bonding wells having a nominal depth; and a dispensing system, coupled to the module fixture, for dispensing a high-wettability adhesive into each the bonding well and surrounding each the element substantially filling the bonding well up to the nominal depth without significant overfill, the adhesive being selectively curable upon application of a curing modality; and a curing structure for selectively exposing the adhesive to the curing modality as the adhesive emerges from the apertures during dispensation of the adhesive.