Invention Grant
- Patent Title: Liquid discharge head substrate and manufacturing method thereof, and liquid discharge head using liquid discharge head substrate and manufacturing method thereof
- Patent Title (中): 液体排出头基板及其制造方法以及使用液体排出头基板的排液头及其制造方法
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Application No.: US12834738Application Date: 2010-07-12
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Publication No.: US08322829B2Publication Date: 2012-12-04
- Inventor: Sadayoshi Sakuma , Hirokazu Komuro , Souta Takeuchi , Takahiro Matsui , Takuya Hatsui
- Applicant: Sadayoshi Sakuma , Hirokazu Komuro , Souta Takeuchi , Takahiro Matsui , Takuya Hatsui
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon USA Inc IP Division
- Priority: JP2009-168986 20090717; JP2009-209540 20090910
- Main IPC: B41J2/045
- IPC: B41J2/045
Abstract:
A liquid discharge head substrate includes an electrode layer, which is electrically connected to an element that generates energy used for discharging a liquid and provided in an inner side of a region between a first face and a third face of a substrate, and a member made of resin which covers the electrode is provided in the region.
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