发明授权
US08322933B2 Optical connection structure between optical backplane and circuit substrate 有权
光背板与电路基板之间的光连接结构

  • 专利标题: Optical connection structure between optical backplane and circuit substrate
  • 专利标题(中): 光背板与电路基板之间的光连接结构
  • 申请号: US12534622
    申请日: 2009-08-03
  • 公开(公告)号: US08322933B2
    公开(公告)日: 2012-12-04
  • 发明人: Junichi Sasaki
  • 申请人: Junichi Sasaki
  • 申请人地址: JP Tokyo
  • 专利权人: NEC Corporation
  • 当前专利权人: NEC Corporation
  • 当前专利权人地址: JP Tokyo
  • 代理机构: Sughrue Mion, PLLC
  • 优先权: JP2005-293767 20051006
  • 主分类号: G02B6/36
  • IPC分类号: G02B6/36 G02B6/38
Optical connection structure between optical backplane and circuit substrate
摘要:
Information processing equipment includes a photoelectric conversion module disposed on a circuit substrate, a first optical connector connected to the photoelectric conversion module through a plurality of first optical fibers and disposed to an edge portion of the circuit substrate, and a second optical connector disposed on an optical backplane and optically connected to the first optical connector. The disposing direction of the optical fibers in the photoelectric conversion module is in nonparallel with the main surface of the circuit substrate and the disposing direction of the optical fibers in the first optical connector and the disposing direction of the optical fibers in the second optical connector are in nonparallel with the main surface of the circuit substrate.
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