发明授权
US08324507B2 Composite metallic particle, dispersion of a composite metallic particle, ink for making a conductive substrate, method for making a conductive substrate and a conductive substrate
有权
复合金属颗粒，复合金属颗粒的分散体，用于制造导电性基材的油墨，导电性基材的制造方法和导电性基材
- 专利标题： Composite metallic particle, dispersion of a composite metallic particle, ink for making a conductive substrate, method for making a conductive substrate and a conductive substrate
- 专利标题（中）： 复合金属颗粒，复合金属颗粒的分散体，用于制造导电性基材的油墨，导电性基材的制造方法和导电性基材
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申请号： US12546117申请日： 2009-08-24
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公开(公告)号： US08324507B2公开(公告)日： 2012-12-04
- 发明人: Kiyohiko Takemoto , Miharu Kanaya
- 申请人： Kiyohiko Takemoto , Miharu Kanaya
- 申请人地址： JP Tokyo
- 专利权人： Seiko Epson Corporation
- 当前专利权人： Seiko Epson Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Nutter McClennen & Fish LLP
- 代理商 John J. Penny, Jr.
- 优先权： JP2008-213642 20080822
- 主分类号： H05K1/09
- IPC分类号： H05K1/09 ; B05D5/12 ; H01B1/22
摘要：
A composite metallic particle made by coating a surface of a base material sheet with a composite metallic thin film layer that contains at least one of a resin layer and a wax layer and at least one of a metal layer and a metal compound layer and step 2 for removing the composite metallic thin film layer from the sheet. The resultant composite metallic particles and conductive ink can be used in a conductive substrate producing apparatus, formed into a pattern on the conductive substrate by screen printing, an ink jet method, or some other liquid-based process.
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