The invention provides an electronic component and a manufacturing method thereof that: can allow electronic components to be mounted on an external substrate at a higher density than before; can adjust the height (level) of a terminal electrode as required and desired, thereby solving problems that would occur in the inspection of the conventional electronic components; and can also improve the yield in the mounting of electronic components, thereby achieving increased productivity. A capacitor 1, which is an electronic component, has: a first upper electrode 5a formed above a substrate 2; a first seat 10 and a second seat 11 which are formed adjacent to the first upper electrode 5a; passivation layers 6 and 8 that cover the first upper electrode 5a and the first and second seats 10 and 11; and a terminal electrode 9a formed above the first and second seats 10 and 11 and connected to the first upper electrode 5a via via-conductors Va and Vc which are formed through the passivation layers 6 and 8 respectively.