发明授权
- 专利标题： Stacked die module
- 专利标题（中）： 堆叠模块
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申请号： US11160477申请日： 2005-06-24
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公开(公告)号： US08324725B2公开(公告)日： 2012-12-04
- 发明人: Igor Y. Khandros , Charles A. Miller , Bruce J. Barbara , Barbara Vasquez
- 申请人： Igor Y. Khandros , Charles A. Miller , Bruce J. Barbara , Barbara Vasquez
- 申请人地址： US CA Livermore
- 专利权人： FormFactor, Inc.
- 当前专利权人： FormFactor, Inc.
- 当前专利权人地址： US CA Livermore
- 代理机构： Kirton & McConkie
- 主分类号： H01L23/485
- IPC分类号： H01L23/485 ; H01L21/00 ; H01L25/16 ; H01L25/065
摘要：
Semiconductor dies are stacked offset from one another so that terminals located along two edges of each die are exposed. The two edges of the dies having terminals may be oriented in the same direction. Electrical connections may connect terminals on one die with terminals on another die, and the stack may be disposed on a wiring substrate to which the terminals of the dies may be electrically connected.
公开/授权文献
- US20060076690A1 Stacked Die Module 公开/授权日：2006-04-13
信息查询
IPC分类:
