发明授权
US08329593B2 Method and apparatus for removing polymer from the wafer backside and edge
失效
从晶片背面和边缘去除聚合物的方法和设备
- 专利标题： Method and apparatus for removing polymer from the wafer backside and edge
- 专利标题（中）： 从晶片背面和边缘去除聚合物的方法和设备
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申请号： US12001989申请日： 2007-12-12
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公开(公告)号： US08329593B2公开(公告)日： 2012-12-11
- 发明人: Imad Yousif , Anchel Sheyner , Ajit Balakrishna , Nancy Fung , Ying Rui , Martin Jeffrey Salinas , Walter R. Merry , Shahid Rauf
- 申请人： Imad Yousif , Anchel Sheyner , Ajit Balakrishna , Nancy Fung , Ying Rui , Martin Jeffrey Salinas , Walter R. Merry , Shahid Rauf
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理商 Robert M. Wallace
- 主分类号： H01L21/302
- IPC分类号： H01L21/302 ; H01L21/461 ; B44C1/22 ; C03C15/00 ; C03C25/68
摘要：
Polymer is removed from the backside of a wafer held on a support pedestal in a reactor using an arcuate side gas injection nozzle extending through the reactor side wall with a curvature matched to the wafer edge and supplied with plasma by-products from a remote plasma source.
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