发明授权
- 专利标题： Semiconductor device including plural electrode pads
- 专利标题（中）： 半导体装置包括多个电极焊盘
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申请号： US12881786申请日： 2010-09-14
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公开(公告)号： US08331182B2公开(公告)日： 2012-12-11
- 发明人: Hiromasa Takeda , Satoshi Isa , Shotaro Kobayashi , Mitsuaki Katagiri
- 申请人： Hiromasa Takeda , Satoshi Isa , Shotaro Kobayashi , Mitsuaki Katagiri
- 申请人地址： JP Tokyo
- 专利权人： Elipida Memory, Inc.
- 当前专利权人： Elipida Memory, Inc.
- 当前专利权人地址： JP Tokyo
- 代理机构： McDermott Will & Emery LLP
- 优先权： JP2009-213112 20090915
- 主分类号： G11C7/06
- IPC分类号： G11C7/06
摘要：
A semiconductor device includes a pad for sense amplifier ground potential as an electrode pad supplying ground potential voltage to a sense amplifier, a first conductive line connected to the pad for sense amplifier ground potential, and a second conductive line connected to an electrode pad closest to the pad for sense amplifier ground potential among plural electrode pads included in a pad row. The second conductive line extends to the opposite side of the first conductive line with the pad row as a reference.
公开/授权文献
- US20110063936A1 SEMICONDUCTOR DEVICE INCLUDING PLURAL ELECTRODE PADS 公开/授权日：2011-03-17
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