发明授权
- 专利标题： Circuit component with conductive layer structure
- 专利标题（中）： 具有导电层结构的电路元件
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申请号： US13098340申请日： 2011-04-29
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公开(公告)号： US08334588B2公开(公告)日： 2012-12-18
- 发明人: Jin-Yuan Lee , Eric Lin
- 申请人： Jin-Yuan Lee , Eric Lin
- 申请人地址： TW Hsinchu
- 专利权人： Megica Corporation
- 当前专利权人： Megica Corporation
- 当前专利权人地址： TW Hsinchu
- 代理机构： McDermott Will & Emery LLP
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A circuit component comprising a substrate, and a conductive layer over the substrate, wherein the conductive layer comprises a first portion between a first opening in the conductive layer and a second opening in the conductive layer, wherein the first and second openings are enclosed by the conductive layer, wherein a void is over the substrate and under the conductive layer, wherein the first portion and the first and second openings are over the void.
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