Invention Grant
- Patent Title: Pre-bundling of RLC SDUs in the RLC layer
- Patent Title (中): 在RLC层中预先捆绑RLC SDU
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Application No.: US12643667Application Date: 2009-12-21
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Publication No.: US08335205B2Publication Date: 2012-12-18
- Inventor: Siddharth Ray , Ashwin Sampath , Arnaud Meylan , Parag A. Agashe
- Applicant: Siddharth Ray , Ashwin Sampath , Arnaud Meylan , Parag A. Agashe
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Nerrie M. Zohn
- Main IPC: H04J3/24
- IPC: H04J3/24
Abstract:
Certain aspects of the present disclosure provide a technique for pre-bundling the received service data units (SDU) into an SDU bundle in a first communication layer before receiving a scheduling information from a second communication layer and adjusting the SDU bundle when the scheduling information is received.
Public/Granted literature
- US20100165936A1 PRE-BUNDLING OF RLC SDUs IN THE RLC LAYER Public/Granted day:2010-07-01
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