Invention Grant
- Patent Title: Roundness measuring apparatus
- Patent Title (中): 圆度测量仪
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Application No.: US12784779Application Date: 2010-05-21
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Publication No.: US08336223B2Publication Date: 2012-12-25
- Inventor: Tatsuki Nakayama , Hideki Shindo
- Applicant: Tatsuki Nakayama , Hideki Shindo
- Applicant Address: JP Kawasaki-shi
- Assignee: Mitutoyo Corporation
- Current Assignee: Mitutoyo Corporation
- Current Assignee Address: JP Kawasaki-shi
- Agency: Rankin, Hill & Clark LLP
- Priority: JP2009-124037 20090522
- Main IPC: G01B5/004
- IPC: G01B5/004

Abstract:
A roundness measuring apparatus includes a stylus stocker and a controller. The stylus stocker stores plural types of styli prepared corresponding to shapes of measurement sites of a measurement target object. The stylus stocker can store styli in such a manner that each stylus can be held thereon and taken out thereof. The stylus stocker is provided outside a measurement region, which is determined on the basis of the operation range of a turntable and a detector driving mechanism. The detector driving mechanism can move the detector to the outside of the measurement region. When a measurement command is given, the controller carries out roundness measurement of the object while controlling the turntable and the detector driving mechanism. When a stylus replacement command is given, the controller carries out stylus replacement operation between a detector main unit and the stylus stocker while controlling the detector driving mechanism.
Public/Granted literature
- US20100293800A1 ROUNDNESS MEASURING APPARATUS Public/Granted day:2010-11-25
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